Development and Characterization of Sn99Ag0.3Cu0.7 -(ZrO2/CuO/TiO2) Nano-Composite Solder Alloys
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24 April
2024
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Presentation room
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The transition to "lead-free" soldering prompted the widespread use of SnAgCu (SAC) solder alloys, notably low Ag content variants such as SAC0307 and SAC105 due to their cost-effectiveness and thermomechanical properties. Enhancing these alloys, nano-sized ceramic particles have been introduced to form "nanocomposite" solder joints.
Various ceramic nanoparticles (NPs) like TiO2, ZrO2, and CuO have been tested to improve mechanical properties and raise the liquidus temperature of the alloy. Mechanically, dispersion-strengthening mechanisms are at play, with NPs located at grain boundaries, suppressing grain growth and enhancing nucleation. This study examines the impact of oxide ceramics (TiO2, ZrO2, CuO) as 0.25wt% reinforcements on SAC0307 solder alloy. After homogeneously mixing NPs into solder paste, standard spreading tests were conducted on FR4 laminates. Solder joints were prepared using surface mounting technology (SMT) and subjected to shear strength testing and corrosion resistance assessment. Microstructure analysis revealed NPs slightly affected wettability and voiding but significantly increased shear strength by promoting dispersion strengthening and grain refinement. CuO NPs performed favorably alongside TiO2 and ZrO2, indicating potential application in soldering technology. TiO2 NPs also improved corrosion resistance.
