Program
09.05 | Briefing of the president of the National Electronics Society of Hungary | |
09.10 | InnoElectro Grand Prize ceremony |
09.30 | Discovering hidden microstructures - How cross-sections reveal what we can't discover otherwise | |
09.55 | Sources of bad soldering in reflow process and how to avoid them | |
10.20 | Improve Quality Control by Unicomp 3D CT & X-Ray | |
10.45 | Cost efficient testing of wireless devices | |
11.10 | Toolkit of Technical Cleanliness | |
11.35 | Flow of information – Rethink workflows, support business with machine vision based on atificial intelligence | |
12.00 | When defects that are not defects! |
13.00 | Assembly as an added value |
14.00 | Advantages of Laser Depaneling | |
14.25 | Managing the challenge of small to medium batch, high mix SMT manufacturing (2) | |
14.50 | Global Point horus: temperature profiling and monitoring made easy - Productronica 2023 Award Winning solution from the soldering expert, Ersa | |
15.15 | New groundbreaking inventions from JUKI | |
15.40 | Company presentation Schnaidt GmbH |
16.05 | Professional literature in Hungarian? – panel |
10.00 | Joint International Master Programme of Smart Systems Integrated Solutions in European Cooperation | |
10.30 | Sustainable and biodegradable circuit carriers: technological implementation and case study | |
11.00 | Application of additive manufacturing technologies in microfluidics | |
11.30 | Aging of LEDs in high humidity environments | |
12.00 | Nanotechnology: the revolution of sensors - optical sensing with nanocomposites |
13.00 | NeoMesh - Low Power Local Area Network | |
13.30 | IoT Data Management | |
14.00 | Overview of Infineon’s research on IoT Applications and IoT Security | |
14.30 | An IoT eco-system based on low power consumption smart sensors and sensor networks |
09.20 | De-Risking Semiconductor Supply before and after End-of-Life. | |
09.45 | Viscom’s AI solutions (vAI) – real life examples for efficient electronics manufacturing | |
10.10 | Cost of Ownership in Reflow Soldering | |
10.35 | How to save costs with automated dipsensing? | |
11.00 | Mixed alloy technology for high reliability in automotive and energy savings |
11.25 | ChipCAD radio network innovations in 2024 | |
11.50 | The World’s Smallest FPGA SoC has 8 pins | |
12.15 | Electrical and mechanical design in cooperation | |
12.40 | 100 years of connectors and their future |
13.20 | Industry-specific challenges and opportunities in R&D in Hungary |
14.20 | Silicon-to-Systems: New ways to approach Electronic Design | |
14.45 | The chip shortage is over, can we prepare for the next one? | |
15.10 | Resilient electronics made possible by modern software |
15.45 | One Stop Shopping: Turnkey Solutions for PCB frontend and backend manufacturing | |
16.10 | Ultrasonic welding of non-ferrous metals for electrical connections |
09.30 | Development and Characterization of Sn99Ag0.3Cu0.7 -(ZrO2/CuO/TiO2) Nano-Composite Solder Alloys | |
10.15 | Assembly Challenges & Solutions for M0201, 08005, and Micro/MiniLED | |
11.00 | Progress in Low Temperature Lead Free Solder Development | |
11.45 | Flux Residue Activity and Volume under QFN Components as a Function of Standoff | |
13.30 | Molecular Fingerprint of Condensate Residues in the Soldering Process | |
14.15 | Robotic Soldering Inspection & Defects Solutions | |
15.00 | Objective Evidence SIR/ECM & Process Control | |
15.45 | Conformal Coating SEC: What is SEC and How to Improve It |
09.35 | Harmonic mixers vs. generic mixers on mm wavelengths | |
10.30 | Development and measurements techniques of a Q-band low noise amplifier (LNA) | |
11.30 | Centimeter wavelength measuring technology |
14.30 | Closing remarks | |
14.35 | MELT Student Soldering Competition announcement of results | |
14.45 | IPC Hand Soldering Competition announcement of results |